Wafer processing tape

摘要

A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.

主权项

1. A wafer processing tape comprising:
a release film; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion, said label portion having a predetermined planar shape and covering the adhesive layer so that the label portion contacts with the release film around the adhesive layer; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed, said support member being disposed at both end portions of the release film in a short side direction of the release film, said support member having a coefficient of linear expansion of 300 ppm/° C. or less, wherein said support member is formed on an area on the second surface of the release film corresponding to an area on the first surface of the release film between an end portion of the release film and an outside of the adhesive layer, and an outer edge of said support member is offset from the end portion of the release film, wherein said support member has the coefficient of linear expansion different from that of the release film by a difference of 250 ppm/° C. or less, said support member has a thickness larger than that of the adhesive layer, said pressure-sensitive adhesive film includes a pressure-sensitive adhesive layer and a base film, said base film has a coefficient of static friction different from that of said support member by a difference of 0.2 to 2.0, and said base film is formed of at least one of an α-olefin homopolymer or copolymer or a mixture thereof, polyurethane, a styrene-ethylene-butene and pentane-based copolymer, and a thermoplastic elastomer.