发明名称 Heat treatment apparatus and heat treatment method
摘要 A heat treatment apparatus including: a processing container for processing wafers held in a boat; heaters for heating the processing container; and a control section for controlling the heaters. Heater temperature sensors are provided between the heaters and the processing container, in-container temperature sensors are provided in the processing container, and movable temperature sensors are provided in the boat. The temperature sensors are connected to a temperature estimation section. The temperature estimation section selects two of the three types of temperature sensors, e.g. the movable temperature sensors and the in-container temperature sensors, and determines the temperature of a wafer according to the following formula: T=T1×(1−α)+T2×α, α>1, where T1 and T2 represent detection temperatures of the selected temperature sensors, and α represents a mixing ratio.
申请公布号 US9324591(B2) 申请公布日期 2016.04.26
申请号 US201213438234 申请日期 2012.04.03
申请人 Tokyo Electron Limited 发明人 Yoshii Koji;Yamaguchi Tatsuya;Wang Wenling;Saito Takanori
分类号 F27D21/00;H01L21/67 主分类号 F27D21/00
代理机构 Burr & Brown, PLLC 代理人 Burr & Brown, PLLC
主权项 1. A heat treatment apparatus comprising: a processing container configured to process an object to be processed; a heating section, provided outside the processing container, configured to externally heat the processing container; a holding section configured to hold the object to be processed and to be carried into and out of the processing container; a holding section transport section configured to carry the holding section into and out of the processing container; a first temperature sensor, provided between the heating section and the processing container, configured to detect the temperature of the heating section; a second temperature sensor, fixed in the processing container, configured to detect the interior temperature of the processing container; a third temperature sensor to be carried into and out of the processing container along with the holding section; a control section for controlling a power to the heating section; and a temperature estimation section configured to select two of the first temperature sensor, the second temperature sensor and the third temperature sensor, and estimate the temperature of the object to be processed based on detection temperatures from the two temperature sensors, wherein the temperature estimation section determines the temperature T of the object to be processed according to the following formula: T=T1×(1−α)+T2×α, α>1, where T1 represents a detection temperature of one of the first temperature sensor, the second temperature sensor and the third temperature sensor, T2 represents a detection temperature of another one of the first temperature sensor, the second temperature sensor and the third temperature sensor, and α represents a mixing ratio.
地址 Minato-Ku JP