发明名称 Molded interior material for vehicle and manufacturing method thereof
摘要 The present invention discloses a molded interior material for a vehicle. A press molded decorative layer that faces a vehicle compartment and a buffer material layer that faces a vehicle body panel are at least press molded, the buffer material layer formed by press molding a fiber structure in which fibers are oriented in a thickness direction. On the decorative layer, a convex portion corresponding to a convex surface of the vehicle body panel is formed. On the buffer material layer, a compression molded portion, which is recessed away from the convex surface of the vehicle body panel toward the convex portion of the decorative layer so that a thickness is 0.03 to 0.5 times of a thickness of a surrounding area and a density is higher than that of the surrounding area, is formed.
申请公布号 US9321412(B2) 申请公布日期 2016.04.26
申请号 US201414301292 申请日期 2014.06.10
申请人 HAYASHI TELEMPU Co., Ltd. 发明人 Ikeji Hiroki;Suzuki Hiroshi
分类号 B32B3/00;B60R13/00;B60R13/02;B32B5/24;B32B3/26;B60N3/04;B32B38/00 主分类号 B32B3/00
代理机构 Yokoi & Co., U.S.A., Inc. 代理人 Yokoi & Co., U.S.A., Inc. ;Yokoi Toshiyuki
主权项 1. A molded interior material for a vehicle, wherein a press molded decorative layer that faces a vehicle compartment and a buffer material layer that faces a vehicle body panel having a convex surface are at least laminated, the buffer material layer formed by press molding a fiber structure in which fibers are oriented in a thickness direction, a convex portion corresponding to the convex surface of the vehicle body panel is formed on the decorative layer, and a compression molded portion, which is recessed away from the convex surface of the vehicle body panel toward the convex portion of the decorative layer so that a thickness of the compression molded portion is 0.03 to 0.5 times of a thickness of a surrounding area and a density of the compression molded portion is higher than that of the surrounding area, is formed on the buffer material layer.
地址 Nagoya-shi, Aichi JP