| 摘要 |
PROBLEM TO BE SOLVED: To provide multiple integrated circuit chip structure for performing inter-chip communication between integrated circuit chips having structure including neither an ESD protection circuit nor an input/output circuit.SOLUTION: Multiple integrated circuit chip structure comprises an inter-chip interface circuit 360 configured to selectively connect an internal circuit of an integrated circuit so as to test an interface circuit 385, having an ESD protection circuit 387 and an input/output circuit 389, for communicating with an external test system during a test and a burn-in procedure. Multiple wiring integrated circuit chip structure comprises a first integrated circuit chip 305 attached to one or more second integrated circuit chips 310 for physically and electrically connecting integrated circuit chips mutually. |
