发明名称 不揮発性半導体記憶装置
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive nonvolatile semiconductor storage device having high reliability.SOLUTION: In a nonvolatile semiconductor storage device, memory strings include: a semiconductor layer having a pair of pillar parts each extending in a vertical direction with respect to a substrate and a connection part formed to connect bottoms of the pair of pillar parts; a charge storage layer formed to surround lateral faces of the pillar parts; a first insulation film including the lateral faces of the pillar parts and the charge storage layer; a first conductive layer formed to cover the lateral faces of the pillar parts and the first insulation film; a second insulation film formed around the connection part; and a second conductive layer formed on the connection part via a gate insulation film.
申请公布号 JP5908389(B2) 申请公布日期 2016.04.26
申请号 JP20120251671 申请日期 2012.11.15
申请人 株式会社東芝 发明人 福住 嘉晃;青地 英明;勝又 竜太;鬼頭 傑;木藤 大;田中 啓安;小森 陽介;石月 恵
分类号 H01L21/8247;H01L21/336;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
代理机构 代理人
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