发明名称 |
TRANSFER FOIL INCLUDING CIRCUIT LAYER AND MANUFACTURING METHOD OF TRANSFER FOIL |
摘要 |
PROBLEM TO BE SOLVED: To provide a transfer foil capable of forming a conductive pattern on a surface of an article, at high location accuracy.SOLUTION: A transfer foil includes: a base material film being soluble in liquid or swellable by liquid; a ground layer disposed on the base material film; and a circuit layer at least partially disposed on the ground layer. The circuit layer includes a plurality of conductive patterns at least partially disposed on the ground layer. The ground layer includes a curable resin configured to be cured by electron irradiation, ultraviolet irradiation or heating.SELECTED DRAWING: Figure 4 |
申请公布号 |
JP2016060089(A) |
申请公布日期 |
2016.04.25 |
申请号 |
JP20140189263 |
申请日期 |
2014.09.17 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
MATSUMORI HITOAKI;SUDO MASATOSHI |
分类号 |
B32B15/08;B44C1/175;H05K3/20 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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