发明名称 TRANSFER FOIL INCLUDING CIRCUIT LAYER AND MANUFACTURING METHOD OF TRANSFER FOIL
摘要 PROBLEM TO BE SOLVED: To provide a transfer foil capable of forming a conductive pattern on a surface of an article, at high location accuracy.SOLUTION: A transfer foil includes: a base material film being soluble in liquid or swellable by liquid; a ground layer disposed on the base material film; and a circuit layer at least partially disposed on the ground layer. The circuit layer includes a plurality of conductive patterns at least partially disposed on the ground layer. The ground layer includes a curable resin configured to be cured by electron irradiation, ultraviolet irradiation or heating.SELECTED DRAWING: Figure 4
申请公布号 JP2016060089(A) 申请公布日期 2016.04.25
申请号 JP20140189263 申请日期 2014.09.17
申请人 DAINIPPON PRINTING CO LTD 发明人 MATSUMORI HITOAKI;SUDO MASATOSHI
分类号 B32B15/08;B44C1/175;H05K3/20 主分类号 B32B15/08
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