| 摘要 |
PROBLEM TO BE SOLVED: To provide a lighting device which is advantageous to downsizing and achieves high heat radiation efficiency.SOLUTION: A lighting device incudes: an LED element mounting substrate 17 on which LED elements 41 are mounted; a heat sink 21 configured to conduct heat generated by the LED elements 41; and a baffle 7 provided at a side, at which light of the LED elements 41 is radiated, and configured to absorb the heat conducted from the heat sink 21. The baffle 7 has: a contact part 47 making thermal contact with the heat sink 21; and a radiation port 49 configured to radiate the light of the LED element 41 to the outside. A thickness of the contact part 47 is formed thicker than a thickness of the baffle 7 at the radiation port 49 side.SELECTED DRAWING: Figure 2 |
