| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC module capable of being manufactured at a lower cost by reducing labor and time required for connecting an IC chip and an antenna in spite of being able to exert high-grade environmental resistance.SOLUTION: In an IC module mounted with an IC chip 2 in a module substrate 1 with a built-in antenna 3, the module substrate 1 is constituted by laminating a plurality of ceramics base material layers 7. The module substrate 1 is concavely formed with a storage concave part 8 for storing the IC chip 2, and the IC chip 2 is stored in the storage concave part 8 in a state that connection electrodes 5, 5 face an aperture plane of the storage concave part 8. A connection terminal 17 of the antenna 3 is disposed in the inner part of the storage concave part 8 outside of the contour line of the IC chip 2 in a planar-view. The aperture plane of the storage concave part 8 is closed by a lid body 23 in a state that a pair of connection electrodes 5 of the IC chip 2, a pair of connection terminals 17 of the antenna 3, and the whole of the connection body 22 connecting these elements are stored in the inner part of the storage concave part 8.SELECTED DRAWING: Figure 1 |
