| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing breaking of wiring on a substrate.SOLUTION: According to one embodiment, a semiconductor device comprises a substrate, a first terminal provided on the substrate and a second terminal which is provided on the substrate and located in a first direction of the first terminal. The above-mentioned device further comprises: first wiring which is provided on the substrate and connected to a first place of the first terminal; and second wiring which is provided on the substrate and connected to a second place of the second terminal. The above-described device further comprises: a component which is provided on the first and second terminals and electrically connected to the first and second terminals; and an encapsulation resin which covers the first and second terminals, the first and second wiring, and the component. Further, the first and second places are provided at positions where the first and second places and the component do not overlap each other in the first direction parallel with a surface of the substrate, and the first and second places and the component do not overlap each other in a second direction which is parallel with the surface of the substrate and perpendicular to the first direction.SELECTED DRAWING: Figure 1 |
