PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To enhance insulation reliability between a pad and a conductor circuit adjoining the pad.SOLUTION: A printed wiring board has NSMD type pads. A solder resist layer having an opening for exposing a NSMD type pad is formed of a lower solder resist layer and an upper solder resist layer formed thereon. The opening includes a lower opening formed in the lower solder resist layer, and an upper opening formed in the upper solder resist layer, and the size of the upper opening is larger than that of the lower opening.SELECTED DRAWING: Figure 1