| 摘要 |
Provided is an interlayer filler composition having excellent adhesion whereby voids are not generated in a cured adhesive layer, extrusion of a filler is reduced as much as possible, and it is possible to form a cured adhesive layer which is adequately cured. An interlayer filler composition for a semiconductor device, the composition containing an epoxy resin (A), a curing agent (B), a filler (C), and a flux (D), the composition having a minimum viscosity value at 100-150°C, and the composition satisfying expressions (1) and (2) simultaneously. (1): 10 < η50/η120 < 500. (2): 1000 < η150/η120. (In the expressions, η50, η120, and η150 are the viscosity of the interlayer filler composition at 50°C, 120°C, and 150°C, respectively.) |
