| 摘要 |
PROBLEM TO BE SOLVED: To uniformly form a protective film on the surface of a wafer regardless of the surface shape of the wafer.SOLUTION: A protective film coating method comprises: a resin sheet mounting step of covering the whole surface of a wafer (W) with a film-like resin sheet (10); a sticking step of closely contacting and sticking the resin sheet, which covers the whole surface of the wafer in the resin sheet mounting step, to the surface of the wafer; and a curing step of curing the resin sheet having been subjected to the sticking step. A protective film is formed on the surface of the wafer according to the thickness of the resin sheet.SELECTED DRAWING: Figure 5 |
