| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head which makes displacement of a substrate less likely to occur.SOLUTION: A thermal head X1 includes: a substrate 7; a heating part 9 provided on the substrate 7; electrodes 17, 19 which are provided on the substrate 7 and electrically connected with the heating part 9; a radiator 1 for radiating heat of the substrate 7; and a connector 31 including connector pins 8 electrically connected with the electrodes 17, 19 by solder 23 and a housing 10 housing the connector pins 8. The substrate 7 is placed on the radiator 1. The connector 31 is disposed so as to be located adjacent to a side surface of the radiator 1. The housing 10 contacts with the side surface of the radiator 1.SELECTED DRAWING: Figure 2 |
