| 发明名称 |
PACKAGE STRUCTURE WITH OPTICAL BARRIER, OPTICAL PACKAGE STRUCTURE AND MANUFACTURING METHODS THEREOF |
| 摘要 |
A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material. |
| 申请公布号 |
US2016111561(A1) |
申请公布日期 |
2016.04.21 |
| 申请号 |
US201514822906 |
申请日期 |
2015.08.11 |
| 申请人 |
SensorTek technology Corp. |
发明人 |
Hsu Feng-Jung;Yang Chu-Yuan;Hsu Yuan-Ching;Chang Yi-Hua |
| 分类号 |
H01L31/0232;H01L31/12;H01L31/18;H01L31/0203 |
主分类号 |
H01L31/0232 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package structure with an optical barrier, comprising:
a substrate; an emitter for emitting disposed on the substrate; a detector for receiving the optical signal disposed on the substrate; an optical barrier disposed between the emitter and the detector for shielding the excess optical signal; and a package material used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material. |
| 地址 |
Hsinchu County TW |
