| 摘要 |
An optoelectronic arrangement includes a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board, wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board, a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board, and the first circuit board and the second circuit board connect to one another such that the surface of the first circuit board faces toward the surface of the second circuit board, and the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface. |
