| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing apparatus capable of improving polishing flatness of front surfaces, rear surfaces and edge portions of wafers.SOLUTION: An embodiment includes a lower surface plate, an upper surface plate disposed over the lower surface plate, a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, and a lift unit either lifting the carrier such that an upper surface of the carrier contacts a lower surface of the upper surface plate or lowering the carrier such that a lower surface of the carrier contacts an upper surface of the lower surface plate.SELECTED DRAWING: Figure 1 |
