| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem of a small sensor manufactured by an MEMS process, which is difficulty of non-destructively inspecting the excellence of processing a structure sensing a physical quantity when an electrode pad, a wiring, or a shield layer is formed in the final process.SOLUTION: There is provided a physical quantity sensor manufactured by an MEMS process configured to include: an electrode substrate; a penetration electrode with a surface electrode on the electrode substrate; and a shield layer formed of metal material on the electrode substrate in planer view, the shield layer containing an inside-observation space for confirming internal defects, and a region around the surface electrode being insulated.SELECTED DRAWING: Figure 1 |
