| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device excellent in heat dissipation.SOLUTION: A semiconductor light-emitting device includes a semiconductor layer having a first layer and a second layer and a luminous layer and a side face, an n-side electrode provided in contact with the first layer, a p-side electrode provided in contact with the second layer, an insulating member for supporting the semiconductor layer, provided in the chip outer region on the outside of the side face of the semiconductor layer, where at least the surface of a part in close proximity to the side face has reflectivity to the light emitted from the luminous layer, an n-side metal layer in contact with the first layer, and extending from a part in contact with the first layer integrally to the chip outer region, and a p-side metal layer in contact with the second layer, and extending from a part in contact with the second layer integrally to the chip outer region.SELECTED DRAWING: Figure 1 |
