| 摘要 |
PROBLEM TO BE SOLVED: To prevent occurrence of a crack in a chip when dividing a wafer.SOLUTION: A division method of a wafer is constituted of a chamfer formation step for forming a chamfer part 9a on one side of a wafer 1 along a division line 3 by ablation, an internal processing step for forming a laser processing layer 8a becoming a division start point in the wafer 1, and a division step for dividing with the laser processing layer 8a as a starting point by pressing the chamfer part 9a along the division line 3 by means of a division blade. Occurrence of a crack in the chip is prevented by preventing contact of the corner of the chip, when dividing the wafer 1 into individual chips.SELECTED DRAWING: Figure 3 |
