| 发明名称 |
T-SHAPED POWER AMPLIFIER COOLING PLATE |
| 摘要 |
Cooled electronic circuitry may include multiple and substantially parallel circuitry surfaces, each containing power amplifier circuitry, having a side edge, and includes material between at least a portion of the base plate and the side edge that provides a level of thermal conductivity of at least 167 W/m-k; and a cooling plate having a flat surface attached to each of the side edges of the circuitry surfaces in a thermally-conductive manner. |
| 申请公布号 |
US2016112013(A1) |
申请公布日期 |
2016.04.21 |
| 申请号 |
US201514691427 |
申请日期 |
2015.04.20 |
| 申请人 |
DAICO INDUSTRIES, INC. |
发明人 |
Mao Ruben X.;White Mark |
| 分类号 |
H03F1/30;H01L23/473;H03F3/21;H01L23/373 |
主分类号 |
H03F1/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. Cooled electronic circuitry comprising:
multiple and substantially parallel circuitry surfaces, each containing power amplifier circuitry, having a side edge, and includes material between at least a portion of the base plate and the side edge that provides a level of thermal conductivity of at least 167 W/m-k; and a cooling plate having a flat surface attached to each of the side edges of the circuitry surfaces in a thermally-conductive manner. |
| 地址 |
Carson CA US |
