| 发明名称 |
SEMICONDUCTOR PACKAGE |
| 摘要 |
A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided. |
| 申请公布号 |
US2016111376(A1) |
申请公布日期 |
2016.04.21 |
| 申请号 |
US201514874609 |
申请日期 |
2015.10.05 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
SEO Byoung-rim;KIM Woon-bae;JUNG Young-doo |
| 分类号 |
H01L23/552;H01L23/31;H01L23/00;H01L23/498 |
主分类号 |
H01L23/552 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a semiconductor chip having an active surface and a non-active surface opposite to the active surface; a ground member on the active surface of the semiconductor chip; and an electromagnetic shielding member passing through the semiconductor chip and electrically connected to the ground member, and the electromagnetic shielding member covering at least some regions of the non-active surface of the semiconductor chip. |
| 地址 |
Suwon-si KR |
