SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

摘要

A base plate (1) includes a fixed surface and a radiating surface which is a surface opposite to the fixed surface. An insulating substrate (3) is bonded to the fixed surface of the base plate (1). Conductive patterns (4,5) are provided on the insulating substrate (3). Semiconductor chips (7,8) are bonded to the conductive pattern (4). An Al wire (12) connects top surfaces of the semiconductor chip (8) to the conductive pattern (5). The insulating substrate (3), the conductive patterns (4 ,5), the semiconductor chips (7 to 10) and the Al wires (11 to 13) are sealed with resin (16). The base plate (1) includes a metal part (19) and a reinforcing member (20) provided in the metal part (19). A Young's modulus of the reinforcing member (20) is higher than a Youngs modulus of the metal part (19).

主权项

1. A semiconductor module comprising:
a base plate including a fixed surface and a radiating surface which is a surface opposite to the fixed surface; an insulating substrate bonded to the fixed surface of the base plate; first and second conductive patterns on the insulating substrate; a semiconductor chip on the first conductive pattern; a wiring member connecting the semiconductor chip to the second conductive pattern; and resin sealing the fixed surface of the base plate, the insulating substrate, the first and second conductive patterns, the semiconductor chip, and the wiring member, wherein the base plate includes a metal part, and a reinforcing member provided in the metal part and having a Young's modulus which is higher than a Young's modulus of the metal part.