| 发明名称 |
PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A package assembly can include: (i) a plurality of electrical components stacked on at least two layers; (ii) a lead frame connected to the electrical components by solder interconnection; (iii) an encapsulating compound overlapping a portion of the lead frame and the electrical components to expose portions of leads of the lead frame from the encapsulating compound; and (iv) a heat sink having a first portion arranged between at least two of the plurality of electrical components on adjacent of the at least two layers, where the heat sink is configured to provide a common heat dissipation path for the electrical components. |
| 申请公布号 |
US2016113144(A1) |
申请公布日期 |
2016.04.21 |
| 申请号 |
US201514875302 |
申请日期 |
2015.10.05 |
| 申请人 |
Silergy Semiconductor Technology (Hangzhou) LTD |
发明人 |
Ye Jiaming;Tan Xiaochun |
| 分类号 |
H05K7/20;H05K3/34;H05K3/28;H05K1/18 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package assembly, comprising,
a) a plurality of electrical components stacked on at least two layers; b) a lead frame connected to said electrical components by solder interconnection; c) an encapsulating compound overlapping a portion of said lead frame and said electrical components to expose portions of leads of said lead frame from said encapsulating compound; and d) a heat sink having a first portion arranged between at least two of said plurality of electrical components on adjacent of said at least two layers, wherein said heat sink is configured to provide a common heat dissipation path for said electrical components. |
| 地址 |
Hangzhou CN |
