| 发明名称 |
SUBSTRATE HOLDING METHOD, SUBSTRATE HOLDING APPARATUS, EXPOSURE APPARATUS AND EXPOSURE METHOD |
| 摘要 |
A wafer holding apparatus for holding a wafer including a wafer holder on which the wafer is placed; and a lift pin that is configured to be lifted up and down with respect to the wafer holder in a direction along a normal line of a placement surface of the wafer, the lift pin includes a tip part, the tip part includes: a bottom part that forms a suction region for sucking a rear surface of the wafer; and a convex part that supports the rear surface of the wafer in the suction region. When a substrate is placed on a target position, it is possible to prevent a local deterioration of flatness of the substrate even if the substrate is large. |
| 申请公布号 |
US2016111318(A1) |
申请公布日期 |
2016.04.21 |
| 申请号 |
US201314892336 |
申请日期 |
2013.05.23 |
| 申请人 |
NIKON CORPORATION |
发明人 |
ICHINOSE Go |
| 分类号 |
H01L21/687;G03F7/20;H01L21/683 |
主分类号 |
H01L21/687 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate holding apparatus for holding a substrate, comprising:
a substrate holding part on which the substrate is placed; and a supporting member that is configured to be lifted up and down with respect to the substrate holding part, an end part of the supporting member including: a suction part that forms a suction region for sucking a rear surface of the substrate; and a supporting part that supports the rear surface of the substrate in the suction region. |
| 地址 |
Tokyo JP |
