| 发明名称 |
Debonding Schemes |
| 摘要 |
A method includes receiving a wafer stack having at least two wafers bonded together. At least one blade is inserted between a first wafer of the at least two wafers and a second wafer of the at least two wafers. The blade has a channel configured to inject air or fluid. The first wafer is debonded from the second wafer using the at least one blade. In another embodiment, a detacher having a convex bottom surface is attached to the wafer stack. The first wafer is debonded from the second wafer using the detacher. |
| 申请公布号 |
US2016111316(A1) |
申请公布日期 |
2016.04.21 |
| 申请号 |
US201414517569 |
申请日期 |
2014.10.17 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Huang Xin-Hua;Liu Ping-Yin;Lin Hung-Hua;Chao Lan-Lin;Tsai Chia-Shiung |
| 分类号 |
H01L21/683;H01L23/00 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
receiving a wafer stack having at least two wafers bonded together; inserting at least one blade between a first wafer of the at least two wafers and a second wafer of the at least two wafers, wherein the at least one blade has a channel configured to inject air or fluid; and separating the first wafer from the second wafer using the at least one blade. |
| 地址 |
Hsin-Chu TW |
