发明名称 STRAINED STACKED NANOSHEET FETS AND/OR QUANTUM WELL STACKED NANOSHEET
摘要 Exemplary embodiments provide for fabricating a nanosheet stack structure having one or more sub-stacks. Aspects of the exemplary embodiments include: growing an epitaxial crystalline initial stack of one or more sub-stacks, each of the sub-stacks having at least three layers, a sacrificial layer A, and at least two different non-sacrificial layers B and C having different material properties, wherein the non-sacrificial layers B and C layers are kept below a thermodynamic or kinetic critical thickness corresponding to metastability during all processing, and wherein the sacrificial layer An is placed only at a top or a bottom of each of the sub-stacks, and each of the sub-stacks is connected to an adjacent sub-stack at the top or the bottom using one of the sacrificial layers A; proceeding with fabrication flow of nanosheet devices, such that pillar structures are formed at each end of the epitaxial crystalline stack that to hold the nanosheets in place after selective etch of the sacrificial layers; and selectively removing sacrificial layers A to all non-sacrificial layers B and C, while the remaining layers in the stack are held in place by the pillar structures so that after removal of the sacrificial layers An, each of the sub-stacks contains the non-sacrificial layers B and C.
申请公布号 US2016111284(A1) 申请公布日期 2016.04.21
申请号 US201514918954 申请日期 2015.10.21
申请人 Samsung Electronics Co., Ltd. 发明人 Kittl Jorge A.;Obradovic Borna J.;Bowen Robert C.;Rodder Mark S.
分类号 H01L21/02;H01L29/06;H01L29/10;H01L21/283;H01L21/306 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method for fabricating a nanosheet stack structure having one or more sub-stacks, the method comprising: growing an epitaxial crystalline initial stack of one or more sub-stacks, each of the sub-stacks having at least three layers, a sacrificial layer A, and at least two different non-sacrificial layers B and C having different material properties, wherein the non-sacrificial layers B and C layers are kept below a thermodynamic or kinetic critical thickness corresponding to metastability during all processing, and wherein the sacrificial layer A is placed only at a top or a bottom of each of the sub-stacks, and each of the sub-stacks is connected to an adjacent sub-stack at the top or the bottom using one of the sacrificial layers A; proceeding with fabrication flow of nanosheet devices, such that pillar structures are formed at each end of the epitaxial crystalline stack that to hold the nanosheets in place after selective etch of the sacrificial layers; and selectively removing sacrificial layers A to all non-sacrificial layers B and C, while the remaining layers B and C in the stack are held in place by the pillar structures, so that after removal of the sacrificial layers A, each of the sub-stacks contains the non-sacrificial layers B and C.
地址 Gyeonggi-do KR