LAMINATE STRUCTURE, DRY FILM, AND FLEXIBLE PRINTED WIRING BOARD

摘要

The present invention provides: a laminate structure and dry film having excellent flexibility and being suitable for an insulating film of a flexible printed wiring board, particularly for a collective formation process of a bending portion (bent portion) and mounting portion (unbent portion); and a flexible printed wiring board having a cured product of said dry film as a protective film. Provided is a laminate structure having a resin layer (A) and a resin layer (B) that is laminated on the flexible printed wiring board with the resin layer (A) interposed therebetween. The resin layer (B) comprises a photosensitive thermosetting resin composition including an alkali-soluble resin, a photopolymerization initiator, and a heat-reactive compound, and the resin layer (A) comprises an alkali-developable resin composition including an alkali-soluble resin and a heat-reactive compound but not including a photopolymerization initiator.