发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technique for manufacturing a flexible semiconductor device by using a flexible substrate, such as a resin substrate.SOLUTION: A flexible display device is manufactured by using a resin substrate by performing: a step of forming a resin substrate on a fixed substrate having a separation layer; a step of forming at least a TFT element on the resin substrate; and a step of peeling the resin substrate from the fixed substrate within a layer of the separation layer or at an interface of the separation layer, by irradiating the separation layer with a laser beam.SELECTED DRAWING: Figure 3
申请公布号 JP2016058740(A) 申请公布日期 2016.04.21
申请号 JP20150209517 申请日期 2015.10.26
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;TAKAYAMA TORU
分类号 H01L21/02;G02F1/1333;G02F1/1368;G09F9/00;G09F9/30;H01L21/336;H01L27/12;H01L29/786 主分类号 H01L21/02
代理机构 代理人
主权项
地址