发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a technique for manufacturing a flexible semiconductor device by using a flexible substrate, such as a resin substrate.SOLUTION: A flexible display device is manufactured by using a resin substrate by performing: a step of forming a resin substrate on a fixed substrate having a separation layer; a step of forming at least a TFT element on the resin substrate; and a step of peeling the resin substrate from the fixed substrate within a layer of the separation layer or at an interface of the separation layer, by irradiating the separation layer with a laser beam.SELECTED DRAWING: Figure 3 |
申请公布号 |
JP2016058740(A) |
申请公布日期 |
2016.04.21 |
申请号 |
JP20150209517 |
申请日期 |
2015.10.26 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
YAMAZAKI SHUNPEI;TAKAYAMA TORU |
分类号 |
H01L21/02;G02F1/1333;G02F1/1368;G09F9/00;G09F9/30;H01L21/336;H01L27/12;H01L29/786 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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