| 发明名称 |
METHOD FOR PERMANENT BONDING OF WAFERS |
| 摘要 |
A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate. |
| 申请公布号 |
US2016111394(A1) |
申请公布日期 |
2016.04.21 |
| 申请号 |
US201514976484 |
申请日期 |
2015.12.21 |
| 申请人 |
EV GROUP E. THALLNER GMBH |
发明人 |
Plach Thomas;Hingerl Kurt;Wimplinger Markus;Flotgen Christoph |
| 分类号 |
H01L23/00;H01L21/762;H01L21/18 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. Method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate, said method comprising:
forming a reservoir in a surface layer of the first contact surface; at least partially filling of the reservoir with one or more first educts; forming a prebond connection by contacting the first contact surface with the second contact surface; and forming a permanent bond between the first and second contact surface, said permanent bond at least partially strengthened by reaction of the first educt with a second educt contained in a reaction layer of the second substrate. |
| 地址 |
St. Florian am Inn AT |
