| 摘要 |
PROBLEM TO BE SOLVED: To prevent occurrence of vacuum suction at the time when semiconductor chip trays are vertically overlapped, without providing a through-hole on a bottom face of a chip pocket or without providing ruggedness in an outer peripheral rib and without increasing costs such as providing an additional processing step for the semiconductor chip trays.SOLUTION: The semiconductor chip tray includes a support plate, an outer peripheral rib that is provided on a front face side of the support plate, and a recess that is provided on a rear face side. The semiconductor chip tray is configured as follows. Namely, the outer peripheral rib is a belt-like projection having a fixed height and is provided around a surface of the support plate, thereby forming an accommodation space including a plurality of chip pockets capable of accommodating a semiconductor chip inside. When one semiconductor chip tray is overlapped with another semiconductor chip tray of the same configuration, a recess on the rear face side of the other semiconductor chip tray that functions as a lid is formed at a position overlapped with a part of the outer peripheral rib of the one semiconductor chip tray and forms a part of an air flow channel from the accommodation space to the outside.SELECTED DRAWING: Figure 3 |
