| 发明名称 |
LIGHT EMITTING DEVICE |
| 摘要 |
A flip chip light emitting diode includes a plurality of light emitting diodes and an encapsulation covering the plurality of light emitting diodes. Each of light emitting diode has a P electrode and an N electrode which are exposed out of the encapsulation. |
| 申请公布号 |
US2016111400(A1) |
申请公布日期 |
2016.04.21 |
| 申请号 |
US201514832725 |
申请日期 |
2015.08.21 |
| 申请人 |
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
LIN HOU-TE;CHANG CHAO-HSIUNG;CHEN PIN-CHUAN;CHEN LUNG-HSIN;TSENG WEN-LIANG |
| 分类号 |
H01L25/075;H01L33/38;H01L33/50;H01L33/62;H01L33/54 |
主分类号 |
H01L25/075 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode packaging configured to be coupled to a circuit, the light emitting diode packaging comprising:
a light emitting diode having a P electrode, an N electrode and a light exiting surface opposite to the P electrode and the N electrode; an encapsulation layer covering the light emitting diode, while leaving the P electrode and N electrode at least partially exposed from the encapsulation layer; and wherein the P electrode and the N electrode is configured to be coupled to the circuit. |
| 地址 |
Hsinchu Hsien TW |
