Solderless Mounting for Semiconductor Lasers

摘要

A first contact surface of a semiconductor laser chip can be formed to a first target surface roughness and a second contact surface of a carrier mounting can be formed to a second target surface roughness. A first bond preparation layer comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer comprising a second metal can optionally be applied to the formed second contact surface. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described.

主权项

1. A method comprising:
forming a first contact surface of a semiconductor laser chip to a first target surface roughness and a second contact surface of a carrier mounting to a second target surface roughness; contacting the first contact surface with the second contact surface; and performing a solderless securing process to further secure the semiconductor laser chip to the carrier mounting.