POWER OVERLAY STRUCTURE HAVING WIREBONDS AND METHOD OF MANUFACTURING SAME

摘要

A power overlay (POL) structure includes a power device (38) having at least one upper contact pad (44,46) disposed on an upper surface of the power device (38), and a POL interconnect layer (88) having a dielectric layer (74) coupled to the upper surface of the power device (38) and a metallization layer (80) having metal interconnects (86) extending through vias formed through the dielectric layer (74) and electrically coupled to the at least one upper contact pad (46,48) of the power device (38). The POL structure also includes at least one copper wirebond (96,98,100) directly coupled to the metallization layer (80).