| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a metaxylylene diamine-based polyamide resin composition with moldability, high temperature physical properties and water absorbing properties superior to those of the conventional methaxylylene diamine-based polyamide resin composition, and a molded product thereof. <P>SOLUTION: The polyamide resin composition includes: 100 pts.mass of (A) a polyamide resin with 70 mol% or more of diamine structural units derived from a xylylene diamine and 50 mol% or more of dicarboxylic acid structural units derived from sebacic acid; 10-100 pts.mass of (B) a modified polyphenylene ether resin; and 1-200 pts.mass of (C) a glass fiber. The xylylene diamine includes 0-30 mol% of a metaxylylene diamine and 100-70 mol% of a paraxylylene diamine. Also provided is a molded product thereof. <P>COPYRIGHT: (C)2013,JPO&INPIT |
