Cooling a secondary component by diverting airflow using an air channel associated with a thermal dissipation device that cools a primary component

摘要

Heat is conducted from a primary component to a thermal dissipation structure. An airflow removes from the thermal dissipation structure. An air channel associated with the thermal dissipation structure diverts a portion of the airflow to a secondary component, thereby providing cooling to the secondary component.

主权项

1. A heat sink for cooling a first component comprising:
a thermal contact surface for conducting heat from the first component ; a thermal dissipation structure for conducting heat away from the thermal contact surface and dissipating heat into a directed airflow; and an air channel for diverting a portion of the directed airflow toward a second component to cool the second component , wherein the second component is not in direct thermal contact with the thermal contact surface or the thermal dissipation structure when the heat sink is deployed, and wherein an internal diameter of the air channel is comparatively narrower at an air exit point than an internal diameter of an air entry point of the heat sink to increase a velocity of the portion of the directed airflow at the air exit point relative to a velocity of the directed airflow at the air entry point.