发明名称 |
Array substrate and method for producing the same, display |
摘要 |
An array substrate, comprising: a substrate; a metal pattern formed on the substrate; an insulation layer formed on the metal pattern and formed with a via therein; and a transparent conductive pattern formed on the insulation layer and electrically connected to the metal pattern through the via, wherein the via has a cross section exhibiting an irregular geometry shape having a curved side edge. |
申请公布号 |
US9318508(B2) |
申请公布日期 |
2016.04.19 |
申请号 |
US201414203948 |
申请日期 |
2014.03.11 |
申请人 |
BOE Technology Group Co., Ltd.;Hefei BOE Optoelectronics Technology Co., Ltd. |
发明人 |
Meng Qingchao;Kwon Kiyoung;Zhu Chengda;Zhou Baoquan |
分类号 |
H05K1/02;H01L27/12;G02F1/1368 |
主分类号 |
H05K1/02 |
代理机构 |
Westman, Champlin & Koehler, P.A. |
代理人 |
Westman, Champlin & Koehler, P.A. |
主权项 |
1. An array substrate, comprising:
a substrate; a metal pattern formed on the substrate; an insulation layer formed on the metal pattern and formed with a via therein; and a transparent conductive pattern formed on the insulation layer and electrically connected to the metal pattern through the via, wherein the via has a cross section exhibiting an irregular geometry shape which having a curved side edge, wherein the metal pattern comprises a first metal pattern and a second metal pattern; and wherein the via comprises a first via corresponding to the first metal pattern and a second via corresponding to the second metal pattern. |
地址 |
Beijing CN |