| 发明名称 | Solder ball and electronic member | ||
| 摘要 | A solder ball which suppresses generation of voids in a joint, excels in a thermal fatigue property, and can also obtain a good drop impact resistance property, and an electronic member using the same are provided. The solder ball is formed of a Sn—Bi type alloy containing Sn as a main element, 0.3 to 2.0 mass % of Cu, 0.01 to 0.2 mass % of Ni, and 0.1 to 3.0 mass % of Bi, and an intermetallic compound of (Cu, Ni)6Sn5 is formed in the Sn—Bi alloy so that the generation of voids in the joint when being jointed to an electrode is suppressed, a thermal fatigue property is excellent, and a good drop impact resistance property can also be obtained. | ||
| 申请公布号 | US9320152(B2) | 申请公布日期 | 2016.04.19 |
| 申请号 | US201414405691 | 申请日期 | 2014.05.12 |
| 申请人 | NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.;NIPPON MICROMETAL CORPORATION | 发明人 | Terashima Shinichi;Kobayashi Takayuki;Tanaka Masamoto;Kimura Katsuichi;Sagawa Tadayuki |
| 分类号 | B23K31/02;H05K3/34;B23K1/00;B23K35/26;C22C13/02;C22C13/00;B23K35/02;H05K1/18 | 主分类号 | B23K31/02 |
| 代理机构 | Kenyon & Kenyon LLP | 代理人 | Kenyon & Kenyon LLP |
| 主权项 | 1. A solder ball formed of a Sn—Bi type alloy containing Sn as a main element, 0.3 to 2.0 mass % of Cu, 0.01 to 0.2 mass % of Ni, and 0.3 to 3.0 mass % of Bi, wherein an intermetallic compound of (Cu, Ni)6Sn5 is formed in the Sn—Bi type alloy. | ||
| 地址 | Tokyo JP | ||