Surface flaw modification for strengthening of glass articles

摘要

Disclosed are controlled chemical etching processes used to modify the geometry of surface flaws in thin glass substrates and glass substrate assemblies formed therefrom, and in particular glass substrates suitable for the manufacture of active matrix displays that are essentially free of alkali metal oxides such as Na2O, K2O and Li2O.

主权项

1. A method for manufacturing an electronic device comprising:
depositing thin film transistors on a first glass substrate; joining the first glass substrate to a second glass substrate to form a glass substrate assembly, there being a gap between the first and second glass substrates; contacting the glass substrate assembly with an aqueous acidic solution for a time from 10 seconds to less than or equal to 10 minutes, whereby glass from each of the first and second substrates is removed to a depth only from 2.5 μm to less than or equal to 20 μm when the time has elapsed; rinsing the aqueous acidic solution from the glass substrate assembly when the time has elapsed; injecting a liquid crystal material into the gap; and wherein the contacting is performed after the step of joining but before the step of injecting.