Beol structures incorporating active devices and mechanical strength

摘要

An integrated circuit and method includes a substrate, a plurality of semiconductor device layers monolithically integrated on the substrate, and a metal wiring layer with vias interconnecting the plurality of semiconductor device layers. The semiconductor device layers are devoid of bonding or joining interface with the substrate.

主权项

1. A circuit, comprising:
a substrate; a plurality of semiconductor device layers monolithically formed on the substrate; and a wiring layer with vias interconnecting the plurality of semiconductor device layers.