PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
摘要
According to the present invention, provided is a printed circuit board, comprising: an insulating member; a first plating layer embedded in a lower area of the insulation member; a second plating layer embedded in an upper area of the insulation layer; and a plating via coupling the first plating layer and the second plating layer arranged in a diagonal direction. Accordingly, high reliability may be secured on a flexible substrate, which requires flexibility.
申请公布号
KR20160041588(A)
申请公布日期
2016.04.18
申请号
KR20140135848
申请日期
2014.10.08
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
HWANG, JUN OH;KWON, KWANG HEE;LEE, SEUNG EUN;LEE, YOUNG KWAN;CHUNG, YUL KYO;IM, SE RANG;SUNG, KI JUNG