发明名称 PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
摘要 According to the present invention, provided is a printed circuit board, comprising: an insulating member; a first plating layer embedded in a lower area of the insulation member; a second plating layer embedded in an upper area of the insulation layer; and a plating via coupling the first plating layer and the second plating layer arranged in a diagonal direction. Accordingly, high reliability may be secured on a flexible substrate, which requires flexibility.
申请公布号 KR20160041588(A) 申请公布日期 2016.04.18
申请号 KR20140135848 申请日期 2014.10.08
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 HWANG, JUN OH;KWON, KWANG HEE;LEE, SEUNG EUN;LEE, YOUNG KWAN;CHUNG, YUL KYO;IM, SE RANG;SUNG, KI JUNG
分类号 H05K3/42;H05K3/18 主分类号 H05K3/42
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