| 发明名称 |
FLEXIBLE SUBSTRATE AND ELECTRONIC APPARATUS EQUIPPED WITH SAME |
| 摘要 |
A flexible board includes: a base film, on which a wiring pattern is formed; a first cover film, which is located on one surface of the base film; and a second cover film, which is located on the other surface of the base film. The bending portion, which is bent when mounting the flexible board on an electronic apparatus, includes both edges on which the first cover film is formed and a central portion from which the base film is exposed. |
| 申请公布号 |
US2016105962(A1) |
申请公布日期 |
2016.04.14 |
| 申请号 |
US201514969585 |
申请日期 |
2015.12.15 |
| 申请人 |
KYOCERA Corporation |
发明人 |
SUZUKI Kengo;MORIMOTO Kouji |
| 分类号 |
H05K1/11;H05K1/02 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A flexible board comprising:
a base film, on which a wiring pattern is formed; a first cover film, which is located on one surface of the base film; and a second cover film, which is located on the other surface of the base film, wherein a bending portion, which is bent when mounting the flexible board on an electronic apparatus, includes both edges on which the first cover film is formed and a central portion from which the base film is exposed. |
| 地址 |
Kyoto-shi JP |
