ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC DEVICE

摘要

An electronic component housing package has an input/output member that is bonded to a hole part of a frame body via a brazing material. This input/output member has a top surface that is bonded to first side wall parts and a second side wall part inside the first side wall parts, and the top surface is provided with a narrow part having a narrow width at a portion that is bonded to the first side wall part. When the input/output member is bonded, the flow of the brazing material on the top surface can be controlled by the narrow part.

主权项

1. An electronic component housing package comprising:
a metal base plate having a mount region on a top surface where an electronic component is mounted; a metal frame body placed on the top surface of the base plate so as to surround the mount region, the metal frame body comprising a plurality of side wall parts including a pair of first side wall parts disposed facing each other so as to place the mount region between the pair of first side wall parts and a second side wall part disposed so as to connect end portions of the pair of first side wall parts, and comprising a hole part having opening to an inner side surface and an outer side surface extending from the second side wall part to the pair of first side wall parts; and an input/output member bonded to the hole part via a brazing material, the input/output member comprising protruding parts inward of the pair of first side wall parts and the second side wall part and outward of the second side wall part and a plurality of wiring conductors to be electrically connected to the electronic component on the protruding parts; the input/output member having a top surface to be bonded to the first side wall parts and the second side wall part, the top surface having a narrow part having a narrow width at a portion where the top surface is bonded to the first side wall part.