| 摘要 |
Provided is a highly reliable semiconductor device. A semiconductor device (10) is provided with: semiconductor modules (1, 2) which have main terminals (1b, 1d, 2b, 2d) led out to the outside and wiring parts (1c, 1e, 2c, 2e) that connect semiconductor elements (1a, 2a) and the main terminals (1b, 1d, 2b, 2d); and bus bars (3, 4) which have terminal parts (3a, 4a) and fitting parts (3b1, 3b2, 4b1, 4b2) connected to the main terminals (1b, 1d, 2b, 2d), and which connect the semiconductor modules (1, 2) in parallel. The maximum resistance (Rm1, Rm2) among the resistances between the terminal parts (3a, 4a) and the respective fitting parts (3b1, 4b1) is 10% or less of the resistance (Ri) of the wiring parts (1c, 1e). The maximum inductance (Lm1, Lm2) among the inductances between the terminal parts (3a, 4a) and the respective fitting parts (3b1, 4b1) is 10% or less of the inductance (Li) of the wiring parts (1c, 1e). |
