VEHICLE-MOUNTED POWER CONVERSION DEVICE

摘要

A vehicle-mounted power conversion device including: a capacitor for smoothing DC voltage; a power module for converting the smoothed DC voltage into AC voltage; a control substrate provided with a connector for a harness; a power module substrate provided with a connector for a harness; a harness connected to the control substrate at one end and connected to the power module substrate at the other end, thereby connecting the control substrate and the power module substrate electrically; and a case and cover for housing the capacitor, the power module, the control substrate, the power module substrate and the harness. In this device, a housing space defined between the case and cover is an integrated space, and a divided position between the case and cover is located further toward bottom wall of the case than the connector of the control substrate and the connector of the power module substrate.

主权项

1. A vehicle-mounted power conversion device comprising:
a capacitor for smoothing DC voltage; a power module for converting the smoothed DC voltage into AC voltage; a control substrate provided with a connector for connecting a harness and capable of outputting a control pulse on the basis of various input signals; a power module substrate provided with a connector for connecting a harness and capable of outputting a driving pulse to the power module on the basis of the control pulse; a harness connected to the connector of the control substrate at one end and connected to the connector of the power module substrate at the other end, thereby connecting the control substrate and the power module substrate electrically; and a case and cover for housing the capacitor, the power module, the control substrate, the power module substrate and the harness, wherein a housing space defined between the case and the cover is an integrated single space, the power module substrate and the control substrate are housed in the integrated single space of the case and the cover, and a divided position between the case and the cover is located further toward a bottom wall of the case than the connector of the control substrate and the connector of the power module substrate.