| 发明名称 |
BONDED WAFER EDGE PROTECTION SCHEME |
| 摘要 |
The present invention relates to a bonded wafer edge protection design. According to the present invention, a method for protecting an edge of a bonded wafer includes a step of fixing bonded wafers by using a wafer fixing module. A gap between the bonded wafers is filled with a protection material along an edge. The method includes the following steps: bonding a first wafer to a second wafer; heating the bonded first and second wafers; and distributing the protection material to the edge gap between the first and second wafers. |
| 申请公布号 |
KR20160040500(A) |
申请公布日期 |
2016.04.14 |
| 申请号 |
KR20160038452 |
申请日期 |
2016.03.30 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LU CHEN FA;TU YEUR LUEN;TSAI SHU JU;WU CHENG TA;TSAI CHIA SHIUNG;CHEN XIAOMENG |
| 分类号 |
H01L21/02;H01L21/18;H01L21/324;H01L21/56 |
主分类号 |
H01L21/02 |
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