| 摘要 |
PROBLEM TO BE SOLVED: To provide a tray which is capable of more surely preventing occurrence of transfer or damage even in an extremely thin or extremely large semiconductor wafer and further extremely reduces the risk of damage in the wafer when taking the wafer out of a housing container.SOLUTION: The tray is substantially circular and provided at upper and lower sides of a wafer with a tape frame. On a tray surface, at least one substantially annular recessed groove is provided in a portion opposite to a ring-shaped frame. In addition, at least one substantially annular recessed groove and/or a recessed groove radially extending from a tray center to an outer edge is provided in a portion opposite to the semiconductor wafer.SELECTED DRAWING: Figure 5 |
