| 发明名称 |
INTERCONNECTS THROUGH DIELECRIC VIAS |
| 摘要 |
A dielectric layer includes a reflow via. The reflow via is formed by reflow of the dielectric layer. An interconnect is in contact through the reflow via. |
| 申请公布号 |
US2016104675(A1) |
申请公布日期 |
2016.04.14 |
| 申请号 |
US201314762799 |
申请日期 |
2013.01.29 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L. P. |
发明人 |
Dooley Kevin;McQuaid Roger;Cheevers Liam;Fitzpatrick David;Byrne Lorraine |
| 分类号 |
H01L23/522;H01L23/528;H01L21/768 |
主分类号 |
H01L23/522 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus comprising:
a first metal layer; a dielectric layer disposed on the first metal layer, wherein the dielectric layer includes a reflow via, formed by reflow of the dielectric layer; and an interconnect in contact with the first metal layer through the reflow via. |
| 地址 |
Houston TX US |
