CHEMICAL MECHANICAL POLISHING PAD WITH INTERNAL CHANNELS
摘要
A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.
申请公布号
WO2016057075(A1)
申请公布日期
2016.04.14
申请号
WO2015US27537
申请日期
2015.04.24
申请人
APPLIED MATERIALS, INC.
发明人
FUNG, JASON G.;BAJAJ, RAJEEV;KRISHNAN, KASIRAMAN;ORILALL, MAHENDRA C.;REDEKER, FRED C.;PERRY, RUSSELL EDWARD;MENK, GREGORY E.;REDFIELD, DANIEL