发明名称 |
TIN OR TIN ALLOY PLATING LIQUID |
摘要 |
Tin or tin alloy plating liquid with a sufficient plated deposit can be formed in the opening without causing burns on the plated film surface or abnormal deposits, and which has a good via filling effect. When a specific α, β-unsaturated carbonyl compound is added into the tin or tin alloy plating liquid, the plating liquid with good via filling performance can be obtained, and the deposit which is substantially free of voids and burns or abnormal deposits on the deposit surface are reduced. |
申请公布号 |
US2016102413(A1) |
申请公布日期 |
2016.04.14 |
申请号 |
US201514972349 |
申请日期 |
2015.12.17 |
申请人 |
Rohm and Haas Electronic Materials LLC |
发明人 |
OKADA Hiroki;SHENGHUA Li;KONDO Makoto |
分类号 |
C25D3/32;H01L21/768;H01L21/288;C25D3/60;C25D7/12 |
主分类号 |
C25D3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Marlborough MA US |