| 摘要 |
PROBLEM TO BE SOLVED: To secure a space usable for various applications between a substrate and a communication module mounted on the substrate.SOLUTION: A communication module 10 to be mounted on a mother board 3 in a signal transmission device includes a lower plate 31a and an upper plate 32a that face each other, and has: a module casing 11 that has a module substrate 34 accommodated between the lower plate 31a and the upper plate 32a; and a male connector 60 that protrudes from the lower plate 31a, and is connected to a female connector 50 provided on the mother board 3. When the male connector 60 is connected to the female connector 50, a gap 70 is formed between the lower plate 31a of the module casing 11 and the mother board 3. |
